FCI extends its reflow process-compatible D-Sub family of connectors by introducing a new right-angle version for Pin-In-Paste (through-hole) technology. This product line extension will allow ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Access our Reader Service Web site to quickly find and request information on products and services found in the pages of Machine Design. Through-hole reflow (THR) is a recently developed method of ...

Vacuum reflow soldering technology, although limited in adoption, is emerging as a key focus in high-reliability electronics. While traditional reflow ...

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An ...

SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) ...