This ball-bonder type wire-bonding machine makes delicate welds at breakneck speeds. It requires many of the same stage and controller capabilities as automated IC programmers, PCB assemblers, FPD and ...
ESEC die bonders at IBM in Burlington, Vt. Human inspectors armed with microscopes used to check the die bonds coming out of IBM's Burlington, Vt., facility. Trouble was, it was practical to ...
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